Xinge YU (于欣格), Ph.D.
Associate Professor, City U. of Hong Kong, 2022-present
Assistant Professor, City U. of Hong Kong, 2018-2021

Posdoc: Univ. of Illinois at Urbana-Champaign;
Northwestern University, 2015-2018
PhD: Univ. of Electron. Sci. & Tech. China
Northwestern University, 2015
BS: U of Electronic Sci. & Tech. China 2009

Dengfeng LI, PhD.
Postdoctoral Fellow, 2019-present
PhD., City U of Hong Kong
M. Eng., Tsinghua University
B. S., Xi’an Jiaotong University
E-mail: dengfli2-c@my.cityu.edu.hk

Soft robots, Biomedical sensors

Ya HUANG, PhD.
Postdoctoral Fellow, 2020-present
PhD., Tsinghua University
M. Eng., Tokyo Institute of Technology
B. Eng., Tsinghua University
E-mail: yhuang@hkcoche.org

Haptic interfaces, Stretchable conductors

Hu LI, PhD.
Postdoctoral Fellow, 2021-present
PhD., Beihang University;
& Beijing Institute of Nanoenergy and Nanosystems
B. Sci., Tianjin Polytechnic University
Email: huli23@cityu.edu.hk

Bio-integrated electronics, Bio-sensors

Jiyu LI, PhD.
Postdoctoral Fellow, 2021-present
PhD., City University of Hong Kong
M.S., Sun Yat-Sen University
B. Eng., Sun Yat-Sen University
E-mail: jiyuli2-c@my.cityu.edu.hk

Skin-integrated electronics, Bio-sensors

Rui SHI, PhD.
Postdoctoral Fellow, 2021-present
PhD., The University of Hong Kong
M.S., Wuhan University
B. Eng., Wuhan University
E-mail: ruishi@cityu.edu.hk

Sweat sensors, Bio-sensors

Binbin ZHANG, PhD.
Postdoctoral Fellow, 2021-present
PhD., Southwest Jiaotong University
Visiting PhD, Georgia Institute of Technology
B. Eng., Southwest Jiaotong University
E-mail: bbzhang@hkcoche.org

Self-powered electronics

Qiang ZHANG, PhD.
Postdoctoral Fellow, 2022-present
PhD., The Hong Kong Polytechnic University
Visiting PhD., University of Heidelberg
M. S. Med., Xi’an Jiaotong University
B. S. Med., Xi’an Jiaotong University
E-mail: qzhan25@cityu.edu.hk

Bio-integrated electronics

Yiming LIU , PhD.
Postdoctoral Fellow, 2022-present
PhD., City U of Hong Kong
M.Sc., Hong Kong U of Science and Technology
B. Eng., Tianjin University
E-mail: lyiming2-c@my.cityu.edu.hk

Epidermal electronics, Wearable human-machine interfaces

Guoqiang XU , PhD.
Postdoctoral Fellow, 2022-present
PhD., The Chinese U of Hong Kong
B. Eng., Tsinghua University
E-mail: guoqiaxu@cityu.edu.hk

Human-machine interfaces, Tactile sensing

Shengxin JIA, PhD.
Postdoctoral Fellow, 2022-present
PhD., University of California, Los Angeles
M. Sc., University of California, Los Angeles
B. S., University of Bath
B. S., Harbin Institute of Technology
E-mail: sxjia@hkcoche.org

Wearable electronics, Haptic

Yue HU, PhD.
Postdoctoral Fellow, 2022-present
PhD., Harbin Institute of Technology
B. S., Jilin University
E-mail: yuehu93@cityu.edu.hk

Soft Materials, Tactile sensors

Kuanming YAO
Postdoctoral Fellow, 2023-present
PhD student, City U of Hong Kong (2019-2023)
B.Eng., Zhejiang University
E-mail: km.Yao@my.cityu.edu.hk

Flexible self-powered electronics, Wearable photoacoustic technology

Zhan GAO
PhD student, City U of Hong Kong (2019-present)
M.Sc., U of Electronic Sci. & Tech. China
B.Eng., U of Electronic Sci. & Tech. China
E-mail: zhangao2-c@my.cityu.edu.hk

Flexible nanomaterials, Stretchable detectors

Mengge WU
Visiting PhD student, City U of Hong Kong (2020-present)
PhD student, U of Electronic Sci. & Tech. China
M.Eng., U of Electronic Sci. & Tech. China
B.Eng., U of Electronic Sci. & Tech. China
E-mail: menggewu2@cityu.edu.hk

Organic electronics

Xingcan HUANG
PhD student, City U of Hong Kong (2020-present)
M.Sc., Shandong University
B.Eng., Qingdao University
E-mail: xhuang439-c@my.cityu.edu.hk

Wearable bio-sensors

Chun Ki YIU
PhD student, City U of Hong Kong (2020-present)
B.Eng., City U of Hong Kong
E-mail: chunkiyiu2-c@my.cityu.edu.hk

Human-Machine Interfaces, Electrical Engineering

Huiling JIA
PhD student, City U of Hong Kong (2020-present)
M.Sc., Hong Kong University of Science and Technology
B.Eng., Beijing University of Chemical Technology
E-mail: huilinjia2-c@my.cityu.edu.hk

Soft Robotics, Control systems

Jingkun ZHOU
PhD student, City U of Hong Kong (2020-present)
M.Sc., Tsinghua University
B.Eng., North University of China
E-mail: jingkzhou3-c@my.cityu.edu.hk

Electrical Engineering, Human-machine interfaces

Jian LI
PhD student, City U of Hong Kong (2021-present)
M. Eng., Zhejiang University
B.Eng., Jilin University
E-mail: jian.li@my.cityu.edu.hk

Soft sensors, Printing electronics

Yanli JIAO
PhD student, City U of Hong Kong (2021-present)
M. Eng., Illinois Institute of Technology
B.Eng., Shanxi Normal University
E-mail: yanlijiao2-c@my.cityu.edu.hk

Bio-sensors

Yuyu GAO
PhD student, City U of Hong Kong (2021-present)
M. Eng., Southwest Jiaotong University
B.Eng., Southwest Jiaotong University
E-mail: yygao9-c@my.cityu.edu.hk

Stretchable electronics, Haptic interfaces

Zhenlin CHEN
PhD student, City U of Hong Kong (2021-present)
M. Eng., Harbin Institute of Technology
B.Eng., Harbin Engineering University
E-mail: zhenlchen5-c@my.cityu.edu.hk

Micro electronics, Bio-sensors

Wooyoung PARK
PhD student, City U of Hong Kong (2022-present)
Research Assistant, City U of Hong Kong (2021-2022)
B. Eng., City U of Hong Kong
E-mail: wypark2-c@my.cityu.edu.hk

Electrical Engineering, Bio-sensors

Pengcheng WU
PhD student, City U of Hong Kong (2022-present)
M. Eng., Zhejiang University
B.Eng., Zhejiang University
E-mail: pengcheng.wu@my.cityu.edu.hk

Epidermal electronics, Soft sensors

Guangyao ZHAO
PhD student, City U of Hong Kong (2022-present)
M. Eng., Tsinghua University
B.Eng., Central South University
E-mail: guangzhao7-c@my.cityu.edu.hk

Tactile sensing, human-machine interface

Yawen YANG
PhD student, City U of Hong Kong (2023-present)
Research Assistant, CityU of HK (2022)
B.Eng., Sun Yat-Sen University
E-mail: yawenyang7-c@my.cityu.edu.hk

Biosensors, Wearable electronics

Ronald Lung CHOW
PhD student, City U of Hong Kong (2023-present)
Research Assistant, CityU of HK (2022-2023)
MPhil, The Hong Kong Polytechnic University
B.Eng., The Hong Kong Polytechnic University
E-mail: lungchow@cityu.edu.hk

Soft materials, bio-electronics

Hehua ZHANG
PhD student, City U of Hong Kong (2023-present)
M. Eng., Fudan University
B.Eng., Tianjin University
E-mail: hehzhang2-c@my.cityu.edu.hk

Bio-integrated electronics